SiPやPoP，WL-CSPなどに代表される高機能・高性能を実現する半

SiPやPoP，WL-CSPなどに代表される高機能・高性能を実現する半導体パッケージの設計は，半導体素子設計・微細加工プロセス設計や，論理設計技術と並び電子産業を支える重要な技術になってきている。また，半導体素子・材料・装置などの設計とともに開発されてきた半導体パッケージ技術は，世界の電子産業を支える重要な産業に育tっている。

結果 (英語) 1:

design of semiconductor package to achieve high-performance represented by pop and sip, etc. wl-csp is, become an important technology to support semiconductor elements and the design and microfabrication process design, the arrangement electronics industry and logic design technology has been. In addition, semiconductor packaging technology that has been developed along with the design of semiconductor devices and the like, materials, and equipment, I have t education in an important industry to support the electronics industry of the world.

結果 (英語) 2:

Realizing high functions such as SiP and PoP, WL-CSP, high-performance semiconductor package design is becoming an important technology supporting the electronic industry, along with the design of semiconductor devices and micro machining process design, logic design techniques. Also, semiconductor packaging technology has been developed with the design of semiconductor devices, materials, and equipment are an important industry of world electronic industry is education t.

結果 (英語) 3:

As for the design of a semiconductor package realizing high-performance high efficiency represented by SiP and PoP, WL-CSP, it is in a minute processing process design and logic design technology and important technology I line up, and to be able to support electronic industry a semiconductor element design. In addition, as for the semiconductor package technology that has been developed with the designs such as a semiconductor element / materials / the device, there is 育 t for important industry to be able to support world electronic industry.